Semiconductor vacuum oven
Semiconductor Vacuum Oven Specification:
Basic parameters
Models
HTC-612D
HTC-613D
Dimension (mm)
L6300*D1450*H1560
Weight
APPROX:3000KG
APPROX:3100KG
Number of heating zones
Top 6/ bottom 6
Number of cooling zones
Top 2/ bottom 2
Top 3/ bottom 3
Cooling method
Forced ice cooling
Exhaust requirements
10m3 /H*2
Void rate
APPROX:1%-2%
Control system
Power requirements
3P 380V 50/60Hz
Total power
60KW
64KW
Segmented starting power
35KW
Power consumption
APPROX:12KW-18KW
APPROX:13KW-18KW
Hot air blower speed regulation
Inverter stepless speed regulation
Heating time
APPROX:30min
Temperature control range
Room temperature ~ 400°C can be set
Production recipes
Multi-combination production recipes can be stored
Transportation
Number of lanes
Single lane
Rail structure
3-segment combined structure
Pallet dimension(mm)
L330*D250
L330*D330
Conveyor height(mm)
900±20
Mode of conveying
Isometric board-pushing
Vacuum system
Minimum vacuum pressure
0.1Kpa
Vacuum pump flow
APPROX:1000L/min
APPROX:1000L/min
Pressure relief time
≤10s
Production efficiency
≥40 s
Optional nitrogen system
Nitrogen structure
Full/partial nitrogen filling
Nitrogen system
Automatic
Nitrogen consumption
APPROX:300-500L/min
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